Via fill compositions for direct attach of devices and methods for applying same

The present invention permits solder joints (22) to be made directly to via and through holes (14) without the solder being wicked into the vias or through holes (14), by filling plated through holes (14) with a conductive novolac epoxy fill composition (16). When cured and overplated (18), the fill...

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Bibliographische Detailangaben
Hauptverfasser:	KULESZA, JOSEPH DUANE, MARKOVICH, VOYA RISTA, BOYKO, CHRISTINA MARIE, KOZLOWSKI, RICHARD MICHAEL, SABIA, JOSEPH GENE, ARLDT, ROY LYNN, CAYSON, BURTRAN JOE, MUSKA, JAMES FRANCIS, PAPATHOMAS, KOSTAS, LAUFFER, JOHN MATTHEW, LIU, PHILIP CHIHCHAU, MAHMOUD, ISSA SAID
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention permits solder joints (22) to be made directly to via and through holes (14) without the solder being wicked into the vias or through holes (14), by filling plated through holes (14) with a conductive novolac epoxy fill composition (16). When cured and overplated (18), the fill composition (16) provides support for the solder joint and provides a flat solderable surface (18) for the interconnection (22). The invention also relates to several novel methods for filling through holes (14) with such fill compositions (16), and to resistors located in through holes (14) and vias.