Printed circuit board and liquid crystal display

The object of the invention is to prevent the flow of molten solder to the adjacent input electrodes and to prevent short-circuiting between electrodes as well as wire breakage from happening by performing a process for avoiding the concentration of shearing stress applied to the input electrodes. T...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NISHI, SATORU, ONODERA, TAKAHIRO, KURIHARA, MIKIO, KUSHIMA, KAZUNARI
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:The object of the invention is to prevent the flow of molten solder to the adjacent input electrodes and to prevent short-circuiting between electrodes as well as wire breakage from happening by performing a process for avoiding the concentration of shearing stress applied to the input electrodes. The lengths of the slit 26 for the input electrodes 28 are made uneven. The input electrodes 28 and the board electrodes 30 are laid over one another. When they are heated, the solder 32 is melted, thereby securing the electrodes 28 and 30. The molten solder 32 flows between the base 22 and the board 18A by capillary action. This flow of solder to the adjacent input electrodes 28 is prevented by forming the convex sections 26A at the lengths of the slit 26 so as to make it uneven to make the base 22 connecting the adjacent input electrodes 28 non-linear. Moreover, in cases of relative motion of the liquid crystal cells 16 and the boards 18A and B, independent deformation becomes possible at the joint section between the convex sections 26A and separate input electrodes 28, thereby avoiding the concentration of shearing stress and increasing the strength.