Method and apparatus for sputtering

A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the vol...

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Hauptverfasser: WATANABE, SHUJIRO, ASAHI GLASS COMPANY LTD, TAKAKI, SATORU, AG TECHNOLOGY CO., LTD, OYAMA, TAKUJI, ASAHI GLASS COMPANY LTD, OSAKI, HISASHI, ASAHI GLASS COMPANY LTD, ANDO, EIICHI, ASAHI GLASS COMPANY LTD, SHIMIZU, JUNICHI, ASAHI GLASS COMPANY LTD
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 mu s to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.