Device for applying solder paste or flux

To apply solder paste and flux to the ends of copper pipes during soft soldering even at relatively inaccessible points during the pipe installation, a device is used which consists of a handle and an application head. Fitted in the handle is a reservoir for the pastes and a delivery device which de...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KRAPPITZ, HARALD, CADORIN, GUENTER, KINZEL, JOSEF, BARBEHOEN, JOERG, GREINEMANN, FRANZ
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!