Device for applying solder paste or flux
To apply solder paste and flux to the ends of copper pipes during soft soldering even at relatively inaccessible points during the pipe installation, a device is used which consists of a handle and an application head. Fitted in the handle is a reservoir for the pastes and a delivery device which de...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!