Device for applying solder paste or flux

To apply solder paste and flux to the ends of copper pipes during soft soldering even at relatively inaccessible points during the pipe installation, a device is used which consists of a handle and an application head. Fitted in the handle is a reservoir for the pastes and a delivery device which de...

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Bibliographische Detailangaben
Hauptverfasser:	KRAPPITZ, HARALD, CADORIN, GUENTER, KINZEL, JOSEF, BARBEHOEN, JOERG, GREINEMANN, FRANZ
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To apply solder paste and flux to the ends of copper pipes during soft soldering even at relatively inaccessible points during the pipe installation, a device is used which consists of a handle and an application head. Fitted in the handle is a reservoir for the pastes and a delivery device which delivers the paste to the application element fastened to the application head.