Resin-sealed semiconductor device containing porous fluororesin
A resin-sealed semiconductor device, including a chip mounting die pad, gold lead wires and a sealing containing porous fluororesin and surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluororesin rather than crack the sealan...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A resin-sealed semiconductor device, including a chip mounting die pad, gold lead wires and a sealing containing porous fluororesin and surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluororesin rather than crack the sealant under internal pressure. |
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