Method of polishing a surface of copper or an alloy comprising mainly copper

Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm for obtaining a plane and smooth polished surface without any defects. A composition of a polishing...

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Bibliographische Detailangaben
Hauptverfasser:	DE BOER, DIRK KORNELIS GERHARDUS, VAN DEN HOOGENHOF, WALTERUS WILHELMUS, POSTMA, LAMBERTUS, HAISMA, JAN, DE HAAS, PETER WILHELMUS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm for obtaining a plane and smooth polished surface without any defects. A composition of a polishing component comprising a colloidal suspension of SiO2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralised water and a chemical activator is used as a polishing means.