Multiple-metal-level integrated device and fabrication process thereof

An integrated device (1) comprising two metal levels (6, 8) separated by a layer of insulating material (3) and connected (10) electrically at respective contact pads (5, 7) located one over the other. The two pads (5, 7) are connected electrically by a number of parallel contact regions (10) having...

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Bibliographische Detailangaben

Hauptverfasser:	CAPRILE, CANDIDA, DE SANTI, GIORGIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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