Method of limiting sticking of body to a susceptor in a deposition treatment

A method of limiting sticking of a body (38, substrate) to a susceptor (18) after the body (38) has been coated with a layer in a deposition chamber (12) by plasma chemical vapor deposition includes subjecting the coated body (38) to a plasma of an inactive gas, e.g., hydrogen, nitrogen, argon or am...

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Bibliographische Detailangaben
Hauptverfasser:	MAYDAN, DAN, KOLLRACK, MARC MICHAEL, LAW, KAM, LEE, ANGELA T, ROBERTSON, ROBERT
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method of limiting sticking of a body (38, substrate) to a susceptor (18) after the body (38) has been coated with a layer in a deposition chamber (12) by plasma chemical vapor deposition includes subjecting the coated body (38) to a plasma of an inactive gas, e.g., hydrogen, nitrogen, argon or ammonia, which does not adversely affect the coating and does not add additional layers to the body (38). After the coated body (38) is subjected to the plasma of the inactive gas, the body (38) is separated from the susceptor (18).