Apparatus and method for tape automated bonding beam lead insulation

An improved apparatus for tape automated bonding insulation including: a substrate (12); at least one electrical contact (18) on the substrate (12); an electrical lead (14) coupled to the electrical contact (18); and an insulator material (20) attached to the substrate (12) for insulating the electr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAPPON ELLEN RIECK, SALTER JAMES, GARCIA ANDRE, REID WILLIAM BRUCE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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