Apparatus and method for tape automated bonding beam lead insulation
An improved apparatus for tape automated bonding insulation including: a substrate (12); at least one electrical contact (18) on the substrate (12); an electrical lead (14) coupled to the electrical contact (18); and an insulator material (20) attached to the substrate (12) for insulating the electr...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | An improved apparatus for tape automated bonding insulation including: a substrate (12); at least one electrical contact (18) on the substrate (12); an electrical lead (14) coupled to the electrical contact (18); and an insulator material (20) attached to the substrate (12) for insulating the electrical lead (14) from the substrate (12). In a specific embodiment the electrical contact (18) is a substantially flat and thin electrically conductive layer (18). In another specific embodiment the insulator material (20) is a polymer photomask material (20) laminated to the substrate (12) and etched to form a raised insulator (20). The improved apparatus for tape automated bonding insulation reduces cost and improves insulation reliatility. |
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