Apparatus and method for tape automated bonding beam lead insulation

Apparatus and method for tape automated bonding beam lead insulation

An improved apparatus for tape automated bonding insulation including: a substrate (12); at least one electrical contact (18) on the substrate (12); an electrical lead (14) coupled to the electrical contact (18); and an insulator material (20) attached to the substrate (12) for insulating the electr...

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Hauptverfasser: TAPPON ELLEN RIECK, SALTER JAMES, GARCIA ANDRE, REID WILLIAM BRUCE
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TAPPON ELLEN RIECK
SALTER JAMES
GARCIA ANDRE
REID WILLIAM BRUCE
description An improved apparatus for tape automated bonding insulation including: a substrate (12); at least one electrical contact (18) on the substrate (12); an electrical lead (14) coupled to the electrical contact (18); and an insulator material (20) attached to the substrate (12) for insulating the electrical lead (14) from the substrate (12). In a specific embodiment the electrical contact (18) is a substantially flat and thin electrically conductive layer (18). In another specific embodiment the insulator material (20) is a polymer photomask material (20) laminated to the substrate (12) and etched to form a raised insulator (20). The improved apparatus for tape automated bonding insulation reduces cost and improves insulation reliatility.
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In a specific embodiment the electrical contact (18) is a substantially flat and thin electrically conductive layer (18). In another specific embodiment the insulator material (20) is a polymer photomask material (20) laminated to the substrate (12) and etched to form a raised insulator (20). 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Apparatus and method for tape automated bonding beam lead insulation
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