Method and resin composition for molding an optical connector ferrule

A resin composition and a method for molding an optical connector ferrule which displays an improvement in melting viscosity and fluidity. The method involves forming a fixing pin insert hole and an optical fiber insert hole within a cavity with a forming pin, injecting a resin composition into said...

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Bibliographische Detailangaben
Hauptverfasser:	HONJO, MAKOTO, YAMANISHI, TORU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A resin composition and a method for molding an optical connector ferrule which displays an improvement in melting viscosity and fluidity. The method involves forming a fixing pin insert hole and an optical fiber insert hole within a cavity with a forming pin, injecting a resin composition into said cavity by transfer molding, and hardening the resin composition. The melting viscosity of the resin composition is from 50 poise to 500 poise as the resin composition is injected into the cavity. The resin composition includes a base resin and a silica powder filler, wherein the silica powder filler constitutes from 75 wt% to 90 wt% of the resin composition, and wherein the silica powder filler has a particle size distribution with a maximum diameter of 100 mu m or less and a peak value from 10 mu m to 20 mu m.