Process preparing a chip to be mounted on a substrate

The present invention relates to the mounting of chips on a substrate, according to the flip-chip method, in which the chip is arranged with its accesses facing the substrate. Small blobs of gold (Bi) obtained by melting the end of a gold wire are welded onto the accesses of the chip (1) and a segment of the gold wire (Di) is left attached to the blob. Mounting on the substrate (2) is carried out when hot, for example by means of a heating table (T), by positioning the chip (1) on the substrate, making use, for that purpose, of the segments of wire (Di) conveniently arranged during an intermediate operation which consists in folding them in a predetermined way. A brazing flux, arranged in advance by means of a stencil, provides for brazing between the blobs (Bi) and the opposite parts of the conductors (Hi) of the substrate. Application to mounting of chips.