Process for electroless copper-plating of substrates and integrated circuits fabricated by this process

Process for copper plating of substrates, especially for microelectronics, integrated circuits and interconnection systems produced with the aid of the said process. This process for autocatalytic chemical deposition of copper on a surface or substrate to be metallised, by chemical reduction of a co...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BRUNI, MARIE-DOMINIQUE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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