Process for electroless copper-plating of substrates and integrated circuits fabricated by this process

Process for electroless copper-plating of substrates and integrated circuits fabricated by this process

Process for copper plating of substrates, especially for microelectronics, integrated circuits and interconnection systems produced with the aid of the said process. This process for autocatalytic chemical deposition of copper on a surface or substrate to be metallised, by chemical reduction of a co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: BRUNI, MARIE-DOMINIQUE
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:Process for copper plating of substrates, especially for microelectronics, integrated circuits and interconnection systems produced with the aid of the said process. This process for autocatalytic chemical deposition of copper on a surface or substrate to be metallised, by chemical reduction of a copper salt in the presence of a reducing agent and of a complexant, is carried out on a substrate which comprises a conductive and nonoxidisable catalytic layer of a chromium-based compound.