Solid state microwave power amplifier module

A solid state high power microwave amplifier module (50). The module incorporates a stacked assembly of integrated low temperature cofired ceramic substrates (80,70) forming a monolithic structure containing all the microwave circuitry required to combine the output power of a large number of monolithic microwave integrated circuit power amplifier chips (58), a heatsink (90) and a power supply (110). One substrate (80) defines an input radial power divider circuit for dividing the input signal into input signals for each power amplifier chip. The second substrate (70) includes the power amplifier chips and a radial combiner circuit. The output of the combiner to coupled to an output waveguide (92) in the heatsink. The module is lightweight and small in size, and of high reliability since the number of wire bonds is greatly reduced since most of the microwave circuitry and connections can be formed as part of the integrated structure.