Corrosion inhibition with Cu-BTA

A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilutesolution of Cu ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu and 1 H-BTA results in a spontaneous interaction of Cu and the metal to...

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Bibliographische Detailangaben
Hauptverfasser:	SCHROTT, ALEJANDRO G, PETERSEN, TINA ALEXEANDRIA, BRUSIC, VLASTA A, FRANKEL, GERALD SIMON, RUSH, BENJAMIN MARK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PHYSICS
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Beschreibung
Zusammenfassung:	A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilutesolution of Cu ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu and 1 H-BTA results in a spontaneous interaction of Cu and the metal to produce a film layer of Cu(I)BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.