Scratch resistant thick T-grain
The invention is generally accomplished by providing a silver halide emulsion wherein said grains comprise tabular silver halide grains of an aspect ratio of less than 4, and wherein greater than 50 percent of said grains have a thickness (T) divided by twin planes separation (S) of greater than 15....
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The invention is generally accomplished by providing a silver halide emulsion wherein said grains comprise tabular silver halide grains of an aspect ratio of less than 4, and wherein greater than 50 percent of said grains have a thickness (T) divided by twin planes separation (S) of greater than 15. It is preferred that such grains comprise greater than 80 percent of said emulsion and that said grains are greater than 0.1 micron equivalent circular diameter. It is further preferred that such emulsion be used in the lower yellow layer of a color negative film. |
|---|