PROCESS FOR MANUFACTURING CIRCUITS

PCT No. PCT/DE91/00709 Sec. 371 Date Mar. 18, 1993 Sec. 102(e) Date Mar. 18, 1993 PCT Filed Sep. 6, 1991 PCT Pub. No. WO92/05677 PCT Pub. Date Apr. 2, 1992.In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film s...

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Hauptverfasser:	SPITZENBERGER, KURT, STEINLE, KLAUS, ZIMMERMANN, HERBERT, STECHER, GUENTHER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PCT No. PCT/DE91/00709 Sec. 371 Date Mar. 18, 1993 Sec. 102(e) Date Mar. 18, 1993 PCT Filed Sep. 6, 1991 PCT Pub. No. WO92/05677 PCT Pub. Date Apr. 2, 1992.In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding conductor paths having contact faces, the ceramic substrate is to be connected with a second circuit plane composed of a green tape substrate.