Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates
There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the m...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHUNG, KYUHA VINCENT, GARY ALLAN BRADY, WILLIAM PATRICK SCHMIDT, RANDALL GENE |
| description | There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0537784B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0537784B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0537784B13</originalsourceid><addsrcrecordid>eNqNi0EKwjAQRbNxIeod5gKCUqWuKxWXgoLLEtNvEwiTkEkr3t4segBX78P7b6med-edCQyKCSJjAglYXHYTSPcWUoaQ1ZPjgcBWs0E_m8CUA_nwKQJp-JKML8lJZ8haLd7aCzYzV4ou7eN83SKGDhK1KUnu2tvuWNX16dDsqz8uP2Y_On4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates</title><source>esp@cenet</source><creator>CHUNG, KYUHA ; VINCENT, GARY ALLAN ; BRADY, WILLIAM PATRICK ; SCHMIDT, RANDALL GENE</creator><creatorcontrib>CHUNG, KYUHA ; VINCENT, GARY ALLAN ; BRADY, WILLIAM PATRICK ; SCHMIDT, RANDALL GENE</creatorcontrib><description>There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene.</description><edition>5</edition><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950301&DB=EPODOC&CC=EP&NR=0537784B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950301&DB=EPODOC&CC=EP&NR=0537784B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHUNG, KYUHA</creatorcontrib><creatorcontrib>VINCENT, GARY ALLAN</creatorcontrib><creatorcontrib>BRADY, WILLIAM PATRICK</creatorcontrib><creatorcontrib>SCHMIDT, RANDALL GENE</creatorcontrib><title>Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates</title><description>There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwjAQRbNxIeod5gKCUqWuKxWXgoLLEtNvEwiTkEkr3t4segBX78P7b6med-edCQyKCSJjAglYXHYTSPcWUoaQ1ZPjgcBWs0E_m8CUA_nwKQJp-JKML8lJZ8haLd7aCzYzV4ou7eN83SKGDhK1KUnu2tvuWNX16dDsqz8uP2Y_On4</recordid><startdate>19950301</startdate><enddate>19950301</enddate><creator>CHUNG, KYUHA</creator><creator>VINCENT, GARY ALLAN</creator><creator>BRADY, WILLIAM PATRICK</creator><creator>SCHMIDT, RANDALL GENE</creator><scope>EVB</scope></search><sort><creationdate>19950301</creationdate><title>Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates</title><author>CHUNG, KYUHA ; VINCENT, GARY ALLAN ; BRADY, WILLIAM PATRICK ; SCHMIDT, RANDALL GENE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0537784B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1995</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHUNG, KYUHA</creatorcontrib><creatorcontrib>VINCENT, GARY ALLAN</creatorcontrib><creatorcontrib>BRADY, WILLIAM PATRICK</creatorcontrib><creatorcontrib>SCHMIDT, RANDALL GENE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHUNG, KYUHA</au><au>VINCENT, GARY ALLAN</au><au>BRADY, WILLIAM PATRICK</au><au>SCHMIDT, RANDALL GENE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates</title><date>1995-03-01</date><risdate>1995</risdate><abstract>There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP0537784B1 |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T09%3A24%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHUNG,%20KYUHA&rft.date=1995-03-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP0537784B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |