Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates

There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the m...

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Bibliographische Detailangaben
Hauptverfasser:	CHUNG, KYUHA, VINCENT, GARY ALLAN, BRADY, WILLIAM PATRICK, SCHMIDT, RANDALL GENE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene.