Interconnect and resistor for integrated circuits

A method is provided for forming a polycrystalline silicon resistive load element of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A lightly doped conductive layer (24) having a conductivity of a first type. A oxide layer (26) is formed over the integrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN, FUSEN E, MILLER, ROBERT O, DIXIT, GIRISH ANANT
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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