Interconnect and resistor for integrated circuits
A method is provided for forming a polycrystalline silicon resistive load element of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A lightly doped conductive layer (24) having a conductivity of a first type. A oxide layer (26) is formed over the integrat...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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