Electrical circuit with resilient gasket support for raised connection features

Electrical circuit with resilient gasket support for raised connection features

A multi-layered flexible circuit comprises a plurality of electrical traces (52) formed on a rigid substrate (50) and each including a contact pad (56) from which is raised a projecting contact feature (58). The contact pads (56) and features (58) extend along a line or lines of such contact pads an...

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Hauptverfasser: BETZ, ROBERT K, WOITH, BLAKE F
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator BETZ, ROBERT K
WOITH, BLAKE F
description A multi-layered flexible circuit comprises a plurality of electrical traces (52) formed on a rigid substrate (50) and each including a contact pad (56) from which is raised a projecting contact feature (58). The contact pads (56) and features (58) extend along a line or lines of such contact pads and connection features, and both the contact pads and the raised features carried thereby are supported at or above the plane of the circuit traces by a compressed molded elastomeric gasket (44) positioned adjacent and edge (66) of the rigid substrate that underlies the traces. The gasket directly underlies the line of contact pads and raised features and is incorporated during the lamination of the several layers.
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The contact pads (56) and features (58) extend along a line or lines of such contact pads and connection features, and both the contact pads and the raised features carried thereby are supported at or above the plane of the circuit traces by a compressed molded elastomeric gasket (44) positioned adjacent and edge (66) of the rigid substrate that underlies the traces. 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The contact pads (56) and features (58) extend along a line or lines of such contact pads and connection features, and both the contact pads and the raised features carried thereby are supported at or above the plane of the circuit traces by a compressed molded elastomeric gasket (44) positioned adjacent and edge (66) of the rigid substrate that underlies the traces. The gasket directly underlies the line of contact pads and raised features and is incorporated during the lamination of the several layers.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; ger
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Electrical circuit with resilient gasket support for raised connection features
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