Electrical circuit with resilient gasket support for raised connection features

A multi-layered flexible circuit comprises a plurality of electrical traces (52) formed on a rigid substrate (50) and each including a contact pad (56) from which is raised a projecting contact feature (58). The contact pads (56) and features (58) extend along a line or lines of such contact pads and connection features, and both the contact pads and the raised features carried thereby are supported at or above the plane of the circuit traces by a compressed molded elastomeric gasket (44) positioned adjacent and edge (66) of the rigid substrate that underlies the traces. The gasket directly underlies the line of contact pads and raised features and is incorporated during the lamination of the several layers.