Solid state image pick-up element

A solid state image pick-up element has a pixel region (13), an output region (12) located near the pixel region (13), and a field portion (11) located remote from the pixel region (13), all of which are formed at un upper layer of a semiconductor substrate (1). The pixel region (13) is provided with plural rows of light receiving portions (4) for performing photoelectric conversion with respect to light received thereby. Between the plural rows of the light receiving portions (4) are interposed transfer portions (3) for transferring signals obtained through the photoelectric conversion. The output region (12) is provided with an output portion (2) for outputting the signals transferred from the transfer portions (3). The semiconductor substrate (1) is covered with three dielectric films (5, 6, 8), and an opening (15) is formed through two dielectric films (6, 8) at a location above the output portion (2).