Disposition for current conducting connection of two copper or aluminium conductors

An intermediate layer (14) whose contact surfaces (18, 20) consist of nickel, tin or silver or a suitable alloy is arranged between the two aluminium or copper conductors (10, 12). By means of such an arrangement, it is possible to utilize the higher permissible excess temperatures in accordance wit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: WUETHRICH, HANS-RUDOLF
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An intermediate layer (14) whose contact surfaces (18, 20) consist of nickel, tin or silver or a suitable alloy is arranged between the two aluminium or copper conductors (10, 12). By means of such an arrangement, it is possible to utilize the higher permissible excess temperatures in accordance with the standards.