Polyoxymethylene resin composition

A polyoxymethylene resin composition excellent in decorative property and hot-stampability comprising 50-97% by weight of polyoxymethylene resin and 3-50% by weight of random polyester copolymer comprising a diol residue A and a dicarboxylic acid residue B, said diol residue A being represented by the formula &lparstr& O-R-O &rparstr& , wherein R is an alkyl group of 2-12 carbon atoms, and said dicarboxylic acid residue B being represented by at least one of formulae (1), (2) and (3), wherein n is an integer of 2-6, l is an integer of 7-24, and Ph is an aromatic hydrocarbon residue, the proportion of (1) to the sum of (1), (2) and (3) being 5-100% by mol, provided that when said proportion is 100% by mol, (1) consist of at least two different types of (1).