SEMICONDUCTOR DEVICE PACKAGE

A semiconductor device is constituted by a semiconductor package having a semiconductor chip therein, a lid bonded to the semiconductor package using an adhesive agent, and a cooler bonded to a surface of the lid. The bonded surface between the semiconductor package and the lid is positioned inside the periphery of the lid by a predetermined distance. Thus, the adhesive agent does not adhere to a side nor surface of the lid and then a cooler can be easily bonded to the lid surface. As a result, a semiconductor device with high reliability can be provided and alignment can be made with ease at the time of modularization by using a plurality of chips.