RESIN-SEALED SEMICONDUCTOR DEVICE CONTAINING POROUS FLUOROCARBON RESIN

A resin-sealed semiconductor device, including a chip mounting die pad, gold lead wires and a sealing containing porous fluororesin and surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluororesin rather than crack the sealan...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	URAKAMI,AKIRA, HAZAKI, YOSHITO, FUKUTAKE,SUNAO, HATAKEYAMA, MINORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A resin-sealed semiconductor device, including a chip mounting die pad, gold lead wires and a sealing containing porous fluororesin and surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluororesin rather than crack the sealant under internal pressure.