Keypad asssembly and instrument using same

A keypad structure includes a stiff backing element and an elastomeric cover that have between them a first membrane on which is defined a shorting conductive layer, a second membrane on which is defined a main conductive layer, the second membrane on which the main conductive layer is defined as being adjacent the elastomeric cover rather than the stiff backing element as in the prior art. A third membrane provides spacing between the main and shorting conductive layers when the keypad is not compressed. A elastomeric interconnect can then be used to connect exposed contacts on the main conductive layer with other circuitry in an instrument utilizing the keypad.