Epoxy resin compositions for use in electrical laminates

An epoxy resin composition useful in an electrical laminate, which composition comprises: (A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, b...

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Bibliographische Detailangaben
Hauptverfasser:	OHMURA, TAKAHIKO, KOHNO, MASAHIKO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	An epoxy resin composition useful in an electrical laminate, which composition comprises: (A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule at a ratio to provide an epoxy to phenolic equivalent ratio of 1:x; (B) y equivalent of a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule; and (C) at least one catalyst for catalyzing a reaction of Component (A) and Component (B); wherein x and y satisfy the following equations: x >/= 0.01 y >/= 0.01 0.02