Chip-type electronic element supplying apparatus

Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be then automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the autom...

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Bibliographische Detailangaben
Hauptverfasser:	TERAZAWA, HIROAKI, KADO, TAKAYOSHI, FUJIWARA, HIROYUKI, NEGISHI, SHIGETOSHI, TANAKA, KUNIO, FUJITA, TAKAYUKI, NAKAMURA, HIDEKAZU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED OPERATIONS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:	Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be then automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the automatic electric element supply apparatus for a chip-type electronic element mounting apparatus in such a manner that a plurality of carrier tape reels can be fastened to the side plates and the carrier tapes are discharged from the tape reels in a ratchet manner while moving adjacently in parallel to one another through another end portion of the body frame. Thus, a multiplicity of kinds of electronic elements can be supplied from one supply apparatus.