CUTTING OF ORGANIC SOLIDS BY CONTINUOUS WAVE ULTRAVIOLET IRRADIATION

A beam (12) of continuous wave ultraviolet light having a wavelength that is absorbed by an organic solid (20) is focused to a spot (18) on a surface of the organic solid (20). Relative motion is imparted between the beam (12) and organic solid (20) at a rate that defines, together with a dimension...

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Bibliographische Detailangaben
1. Verfasser:	SRINIVASAN, RANGASWAMY
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A beam (12) of continuous wave ultraviolet light having a wavelength that is absorbed by an organic solid (20) is focused to a spot (18) on a surface of the organic solid (20). Relative motion is imparted between the beam (12) and organic solid (20) at a rate that defines, together with a dimension of the spot (18), an effective pulse width. Within prescribed ranges of the wavelength, power density and effective pulse width, a new cutting regime was discovered whereby organic solids can be cut at rates and with a quality of cuts previously requiring pulsed ultraviolet laser sources.