A method of enhancing the properties of a thin film on a substrate

Properties of a thin film of vacuum deposited material, such as titanium nitride, on a substrate are enhanced by plasma or thermal annealing of the thin film without removing the film from a vacuum environment. The annealing step may be performed in the same vacuum chamber as the sputter deposition,...

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Bibliographische Detailangaben
Hauptverfasser:	GILBOA, HAIM, MOSELY, RODERICK C
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Properties of a thin film of vacuum deposited material, such as titanium nitride, on a substrate are enhanced by plasma or thermal annealing of the thin film without removing the film from a vacuum environment. The annealing step may be performed in the same vacuum chamber as the sputter deposition, or in a different vacuum chamber, provided the substrate can be transferred between chambers while remaining in a vacuum environment.