Dispersion strengthened lead-tin alloy solder

Addition of up to 5 vol. % of particles of intermetallics such as Ni3Sn4 and Cu9NiSn3 to a lead-tin alloy solder results into a dispersion strenghtened alloy having an improved strength and durability of the soldered joint obtained therefrom.

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Bibliographische Detailangaben
Hauptverfasser:	KANE, ROBERT, MCGEE, SUSAN, BETRABET, HEMANT, BOSER, OTMAR, CAULFIELD, THOMAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Addition of up to 5 vol. % of particles of intermetallics such as Ni3Sn4 and Cu9NiSn3 to a lead-tin alloy solder results into a dispersion strenghtened alloy having an improved strength and durability of the soldered joint obtained therefrom.