Fiber reinforced epoxy prepreg and fabrication thereof

A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally adv...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SCHMITT, GEORGE P, CIBULSKY, MICHAEL J, PAPATHOMAS, KOSTAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally advancing the prereacted product to the desired state of crosslinking to thereby form the prepreg.