Process for producing a printed wiring board

A process for the production of a printed wiring board which comprises preparing a copper-clad laminate (1a,1b) having a through-hole (10) formed by drilling; providing a first resist pattern (21) on the surface of the copper-clad laminate (1a,1b) so as to cover a portion (16) to be formed as a conductor pattern; etching the copper-clad laminate (1a,1b) removing the first resist pattern (21); subjecting the whole laminate to an electroless copper plating (3); laminating a dry film resist (4) on the copper-clad laminate (1a,1b); exposing and developing the dry film resist (4) to form a second resist pattern (41) in such a manner that the through-hole (10) and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating (5); removing the second resist pattern (41); and removing the exposed electroless copper plating (3) through etching.