WIRING CONNECTING DEVICE

A wiring connecting device (1) for mounting an IC chip (2), comprises a flexible substrate (10) on which are mounted connecting wires (11,12) having connecting portions (C1,C2) for making electrical connections with the IC chip, and an aperture (h1,h2,h3) in the flexible substrate (10) completely ov...

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Bibliographische Detailangaben
1. Verfasser:	KAMIMURA, MASARU
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY CURRENT COLLECTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES LINE CONNECTORS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A wiring connecting device (1) for mounting an IC chip (2), comprises a flexible substrate (10) on which are mounted connecting wires (11,12) having connecting portions (C1,C2) for making electrical connections with the IC chip, and an aperture (h1,h2,h3) in the flexible substrate (10) completely over which the connecting portions (C1,C2) extend.