Near neutral pH etching solution for molybdenum or tungsten and method for using it

A neutral or near neutral pH etching solution for effectively etching molybdenum and tungsten including: an aqueous ferricyanide ion solution, a soluble molybdate or tungstate, and an essential compound such that upon combination of said soluble molybdate or tungstate and said essential compound, a heteropoly compound is formed in which said essential compound contributes at least one heteroatom to said heteropoly compound. The etching solution is most preferably used for etching molybdenum or tungsten which is adhered or proximate to a base-sensitive material.