Localized soldering station
A localized soldering station (10) is described that uses the vapor phase reflow principle. A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a m...
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| creator | LYNCH, ROBERT JOHN VITTONE, JEAN MARIE MOTTER, JAMES GEORGE, JR REPCHAK, STEVE ANDREW YETTER, LAWRENCE ROBERT GLOVATSKY, ANDREW ZACHARY |
| description | A localized soldering station (10) is described that uses the vapor phase reflow principle. A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a module (28) with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle (27) confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light (29). Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve (15) through cooling fins (16) where it changes back to a liquid and returns to the container (11), avoiding loss. |
| format | Patent |
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A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a module (28) with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle (27) confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light (29). Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve (15) through cooling fins (16) where it changes back to a liquid and returns to the container (11), avoiding loss.</description><language>eng ; fre ; ger</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; ORGANIC CHEMISTRY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19911009&DB=EPODOC&CC=EP&NR=0450329A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19911009&DB=EPODOC&CC=EP&NR=0450329A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LYNCH, ROBERT JOHN</creatorcontrib><creatorcontrib>VITTONE, JEAN MARIE</creatorcontrib><creatorcontrib>MOTTER, JAMES GEORGE, JR</creatorcontrib><creatorcontrib>REPCHAK, STEVE ANDREW</creatorcontrib><creatorcontrib>YETTER, LAWRENCE ROBERT</creatorcontrib><creatorcontrib>GLOVATSKY, ANDREW ZACHARY</creatorcontrib><title>Localized soldering station</title><description>A localized soldering station (10) is described that uses the vapor phase reflow principle. A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a module (28) with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle (27) confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light (29). Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve (15) through cooling fins (16) where it changes back to a liquid and returns to the container (11), avoiding loss.</description><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD2yU9OzMmsSk1RKM7PSUktysxLVyguSSzJzM_jYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEGJqYGxkaWjkbGRCgBAEn0Izo</recordid><startdate>19911009</startdate><enddate>19911009</enddate><creator>LYNCH, ROBERT JOHN</creator><creator>VITTONE, JEAN MARIE</creator><creator>MOTTER, JAMES GEORGE, JR</creator><creator>REPCHAK, STEVE ANDREW</creator><creator>YETTER, LAWRENCE ROBERT</creator><creator>GLOVATSKY, ANDREW ZACHARY</creator><scope>EVB</scope></search><sort><creationdate>19911009</creationdate><title>Localized soldering station</title><author>LYNCH, ROBERT JOHN ; VITTONE, JEAN MARIE ; MOTTER, JAMES GEORGE, JR ; REPCHAK, STEVE ANDREW ; YETTER, LAWRENCE ROBERT ; GLOVATSKY, ANDREW ZACHARY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0450329A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1991</creationdate><topic>ACYCLIC OR CARBOCYCLIC COMPOUNDS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>LYNCH, ROBERT JOHN</creatorcontrib><creatorcontrib>VITTONE, JEAN MARIE</creatorcontrib><creatorcontrib>MOTTER, JAMES GEORGE, JR</creatorcontrib><creatorcontrib>REPCHAK, STEVE ANDREW</creatorcontrib><creatorcontrib>YETTER, LAWRENCE ROBERT</creatorcontrib><creatorcontrib>GLOVATSKY, ANDREW ZACHARY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LYNCH, ROBERT JOHN</au><au>VITTONE, JEAN MARIE</au><au>MOTTER, JAMES GEORGE, JR</au><au>REPCHAK, STEVE ANDREW</au><au>YETTER, LAWRENCE ROBERT</au><au>GLOVATSKY, ANDREW ZACHARY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Localized soldering station</title><date>1991-10-09</date><risdate>1991</risdate><abstract>A localized soldering station (10) is described that uses the vapor phase reflow principle. A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a module (28) with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle (27) confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light (29). Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve (15) through cooling fins (16) where it changes back to a liquid and returns to the container (11), avoiding loss.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ACYCLIC OR CARBOCYCLIC COMPOUNDS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC CHEMISTRY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Localized soldering station |
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