Localized soldering station

A localized soldering station (10) is described that uses the vapor phase reflow principle. A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a m...

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Bibliographische Detailangaben
Hauptverfasser:	LYNCH, ROBERT JOHN, VITTONE, JEAN MARIE, MOTTER, JAMES GEORGE, JR, REPCHAK, STEVE ANDREW, YETTER, LAWRENCE ROBERT, GLOVATSKY, ANDREW ZACHARY
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC CHEMISTRY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A localized soldering station (10) is described that uses the vapor phase reflow principle. A container (11) has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit (14) maintains the vapor state while conveying the vapor to a work location (13) where a module (28) with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle (27) confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light (29). Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve (15) through cooling fins (16) where it changes back to a liquid and returns to the container (11), avoiding loss.