Electronic device employing a conductive adhesive

An electronic device (10) which includes a circuit sheet (12) having a conductive path (14) thereon. An adhesive (18) is deposited on the conductive path (14), the adhesive (18) including a nonconductive base incorporating randomly spaced conducive particles (22). A circuit component (20) is forced...

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Bibliographische Detailangaben
Hauptverfasser:	HESTER, TODD A, ARNESON, DON A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	An electronic device (10) which includes a circuit sheet (12) having a conductive path (14) thereon. An adhesive (18) is deposited on the conductive path (14), the adhesive (18) including a nonconductive base incorporating randomly spaced conducive particles (22). A circuit component (20) is forced through the adhesive (18), the conductive path (14) and the circuit sheet (12) carrying a portion of the adhesive (18) therewith between the circuit component (20) and the conductive path (14). The carried portion (30) of the adhesive (18) is compressed for establishing contact between the conductive particles (22) and thereby conductivity between the circuit component (20) and the conductive path (14) leaving the adhesive (18) other than that portion in a nonconductive state.