Vibration/acceleration sensor

Disclosed is a vibration/acceleration sensor of a structure wherein a basic sensor unit is fixed to a casing (8) mounted on a body whose vibrations are to be detected and is surrounded by a resinous material (7) having a low heat transfer coefficient, the basic sensor unit comprising a vibration det...

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Bibliographische Detailangaben
Hauptverfasser:	FUKADA, TETSUJI, KAINOU, KIKUO, WAKAMIYA, MASAYUKI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TESTING
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Beschreibung
Zusammenfassung:	Disclosed is a vibration/acceleration sensor of a structure wherein a basic sensor unit is fixed to a casing (8) mounted on a body whose vibrations are to be detected and is surrounded by a resinous material (7) having a low heat transfer coefficient, the basic sensor unit comprising a vibration detecting unit (3) including a piezoelectric bending vibrator (11), thin plates (4) each consisting of, for example, a resinous material having a low heat transfer coefficient, provided respectively on the upper and lower surfaces of the vibration detecting unit (3), and a signal processing circuitry (5) formed on the upper thin plate (4a).