Package for power semiconductor components

A heat dissipating module and package for power microwave transistors and method of making same that includes a substrate having a thick copper layer bonded to a ceramic core which is thereto subjected to high processing temperatures.

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Bibliographische Detailangaben
Hauptverfasser:	PETROSKY, KENNETH JOSEPH, RAIOUDHURY, PROSENJIT, PAPANIA, RICHARD REGIS, BUHAY, HARRY, MADIA, GENE ANTHONY, COSTELLO, JOHN ANDREW
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A heat dissipating module and package for power microwave transistors and method of making same that includes a substrate having a thick copper layer bonded to a ceramic core which is thereto subjected to high processing temperatures.