Three dimensional microelectronic packaging

Bibliographische Detailangaben

Hauptverfasser:	NOYAN, ISMAIL CEVDET, HORTON, RAYMOND ROBERT, BREGMAN, MARK FIELDING, PALMER, MICHAEL JON
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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