Method for fabricating multilayer circuits
A method for fabricating multilayer circuits comprising patterned conductive layers separated by dielectric layers and connected by vias in the dielectric, wherein the unfired dielectric layers are laminated as tapes or sheets over either a fired or unfired conductor layer while under a vacuum.
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A method for fabricating multilayer circuits comprising patterned conductive layers separated by dielectric layers and connected by vias in the dielectric, wherein the unfired dielectric layers are laminated as tapes or sheets over either a fired or unfired conductor layer while under a vacuum. |
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