Master slice semiconductor device and method of forming it
A bonding pad (2) to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape, and a bonding pad (3) which is not to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape with a notched position (5a) in th...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A bonding pad (2) to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape, and a bonding pad (3) which is not to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape with a notched position (5a) in the center. The outer shapes of the electrode pads (2, 3) are varied in accordance with packages which contain semiconductor chip. |
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