CVD PROCESS FOR DEPOSITING A LAYER ON AN ELECTRICALLY CONDUCTIVE THIN-LAYER STRUCTURE

PCT No. PCT/EP89/00126 Sec. 371 Date Jul. 20, 1990 Sec. 102(e) Date Jul. 20, 1990 PCT Filed Feb. 10, 1989 PCT Pub. No. WO89/07665 PCT Pub. Date Aug. 24, 1989.A method for depositing a layer of additional material onto an electrically conductive thin layer structure preferably by means of the thermal...

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Hauptverfasser:	GOTTSLEBEN, OLIVER, STUKE, MICHAEL
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	PCT No. PCT/EP89/00126 Sec. 371 Date Jul. 20, 1990 Sec. 102(e) Date Jul. 20, 1990 PCT Filed Feb. 10, 1989 PCT Pub. No. WO89/07665 PCT Pub. Date Aug. 24, 1989.A method for depositing a layer of additional material onto an electrically conductive thin layer structure preferably by means of the thermally induced reason of a compound in the vapor state, in which the thin structure is heated by an electric current passed through it. The method is especially suitable for reinforcing metallic conductor structures which have been made on a substrate by a direct-writing-laser chemical vapor deposition method, for example, fine tungsten wires.