Method of manufacturing a thick film resistor element
A conductive paste layer (12) of less than 5 mu m is formed on an insulating substrate (11). After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality of electrode pairs (12a, 12b, 12c). Resistor layers (13) are formed corresponding to each pa...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A conductive paste layer (12) of less than 5 mu m is formed on an insulating substrate (11). After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality of electrode pairs (12a, 12b, 12c). Resistor layers (13) are formed corresponding to each pair of the electrodes so as to partially overlap with the electrodes. |
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